ISSN : 2582-5887
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Volume-4,Issue-2
Title : The Role of Thermal Aging in Crack Growth of Lead-Free Solder Interconnects
Author : Samuel Ambosta,
Anuraag Karnik,
Pavan Rajmane,
Dereje Agonafer.
USA
Paper ID : UIJES:4201
Pages : (1-19)
Title : An Exploration of execution and Influence of cloud computing in Supply Chain Stewards
Author : Narmadha Eluri,
Asst’ Professor of CSE, Bapatla Women’s Engineering College, Bapatla.
Paper ID : UIJES:4202
Pages : (20-25)